Characteristics:
4 edges cut and sealed by ultrasonic method, to prevent linting and scratching. Durable, soft, non-abrasive wipe. Excellent liquid absorption. Assures cleanliness with ultra low levels of particles, ions and extractable consistent with Class 1 cleanroom environments. Resists abrasion under rigorous use. Processed and packaged in double bag in Class 10 cleanroom. Laundered by 17MO of ultra-pure D.I. water. Low generation of static electricity.

Applications:
Class 1 cleanrooms. Ultra sensitive semiconductor, TFT-LCD, lens manufacturing processes. Equipment cleaning in rigorous manufacturing operations. Excellent for use in critical environments where abrasion resistance is required.

Characteristics:
4 edges cut and sealed by ultrasonic method, to prevent linting and scratching. Durable, soft, non-abrasive wipe. Excellent liquid absorption. Extremely low metallic ion contents and extractables. Processed and packaged in double bag in Class 10 cleanroom. Laundered by 17MO of ultra-pure D.I. water. Low generation of static electricity.

Applications:
Class 10-100 cleanrooms. Control of sub-micron particles, fibres and chemical residues. Cleaning semiconductor components, TFT-LCD, PDP, opto-electronics, optics, aerospace parts and sensitive equipments. General use when sterilised in pharmaceutical industries.

Characteristics:
4 edges cut and sealed by ultrasonic method, to prevent linting and scratching. Durable, soft, non-abrasive wipe. Excellent liquid absorption. Extremely low metallic ion contents and extractables. Processed and packaged in double bag in Class 10 cleanroom. Laundered by 17MO of ultra-pure D.I. water. ESD protection to products with uniformly dissipative performance.

Applications:
Class 10-100 cleanrooms. Sensitive electronic components, TFT-LCD, PDP, optics, aerospace parts. All ESD sensitive applications.

Structure:
100% continuous-filamentdouble knitted polyester wipe.

Characteristics:
4 edges cut and sealed by ultrasonic method, to prevent linting and scratching. Durable, soft, non-abrasive wipe. Excellent liquid absorption. Extremely low metallic ion contents and extractables. Processed and packaged in double bag in Class 10 cleanroom. Laundered by 17MO of ultra-pure D.I. water. Low generation of static electricity.

Applications:
Class 10 cleanrooms. Ultra high semiconductor processes, TFT-LCD, PDP, opto-electronics, optics, aerospace parts and sensitive equipments. General use in extremely sensitive manufacturing operations. General use when sterilised in pharmaceutical industries.

Structure:
100% continuous-filament polyester knitted wipe.

Characteristics:
2 edges cut and sealed by ultrasonic method, 2 edges cut by knife.
Durable, soft, non-abrasive wipe.
Excellent liquid absorption.
Extremely low metallic ion contents and extractables.
Processed and packaged in double bag in Class 10 cleanroom.
Laundered by 17MO of ultra-pure D.I. water.

Applications:
Class 10-100 cleanrooms.
Control of sub-micron particles, fibres and chemical residues.
Cleaning semiconductor components, optics, aerospace parts and sensitive equipments.
General use when sterilised in pharmaceutical industries.

Structure:
100% continuous-filament polyester knitted wipe.

Characteristics:
Economic choice between non-woven materials and high-end synthetic wipes.
2 edges cut and sealed by ultrasonic method, 2 edges cut by knife.
Durable, soft, non-abrasive wipe.xcellent liquid absorption.
Processed and packaged in double bag in Class 10 cleanroom.

Applications:
Class 100-10,000 cleanrooms.
General operational equipment.
General industrial application.

Processed and packaged in Class 10 cleanroom.
4 edges cut and sealed by ultrasonic method.
100 % continuous filament yarn
Absorbency 520 ml/m²